EP13E7D2J-24.000M
REGULATORY COMPLIANCE
2011/65 +
2015/863
(Data Sheet downloaded on Aug 26, 2020)
191 SVHC
ITEM DESCRIPTION
Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 2.5mm x 3.2mm Ceramic Surface Mount (SMD)
24.000MHz ±50ppm over -20°C to +70°C
ELECTRICAL SPECIFICATIONS
Nominal Frequency
Frequency Tolerance/Stability
24.000MHz
±50ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability
over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°, 260°C
Reflow, Shock, and Vibration)
±5ppm/Year Maximum
3.3Vdc ±5%
12mA Maximum
90% of Vdd Minimum (IOH = -8mA)
10% of Vdd Maximum (IOL = +8mA)
6nSec Maximum (Measured at 20% to 80% of waveform)
50 ±5(%) (Measured at 50% of waveform)
30pF Maximum
CMOS
Power Down
90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output
30µA Maximum (Pin 1 = Ground)
350pSec Maximum
10mSec Maximum
-55°C to 125°C
Aging at 25°C
Supply Voltage
Input Current
Output Voltage Logic High (Voh)
Output Voltage Logic Low (Vol)
Rise/Fall Time
Duty Cycle
Load Drive Capability
Output Logic Type
Pin 1 Connection
Pin 1 Input Voltage (Vih and Vil)
Standby Current
Absolute Clock Jitter
Start Up Time
Storage Temperature Range
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility
Fine Leak Test
Gross Leak Test
Mechanical Shock
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Resistance to Solvents
Solderability
Temperature Cycling
Thermal Shock
Vibration
MIL-STD-883, Method 3015, Class 1, HBM: 1500Vdc
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-202, Method 215
MIL-STD-883, Method 2003
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1011, Condition B
MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 1 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EP13E7D2J-24.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
PIN
CONNECTION
Power Down
Ground
Output
Supply Voltage
1
2.50
±0.15
MARKING
ORIENTATION
1.05
±0.15
2
1.20
±0.10
1
1.00
±0.10
0.75 ±0.10 (X4)
3
2
3
4
LINE MARKING
3.20
±0.15
1.00
±0.10
4
1
2
E24.000
E=Ecliptek Designator
XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
Suggested Solder Pad Layout
All Dimensions in Millimeters
0.95 (X4)
1.20 (X4)
1.00
Solder Land
(X4)
0.80
All Tolerances are ±0.1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 2 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EP13E7D2J-24.000M
OUTPUT WAVEFORM & TIMING DIAGRAM
POWER DOWN INPUT
V
IH
V
IL
CLOCK OUTPUT
V
OH
80% of Waveform
50% of Waveform
20% of Waveform
V
OL
t
PLZ
Fall
Time
Rise
Time
T
W
T
Duty Cycle (%) = T
W
/T x 100
t
PZL
OUTPUT DISABLE
(LOGIC LOW)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 3 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EP13E7D2J-24.000M
Test Circuit for CMOS Output
Oscilloscope
Frequency
Counter
+
+
Power
Supply
_
+
Voltage
Meter
_
Current
Meter
_
Supply
Voltage
(V
DD
)
Probe
(Note 2)
Output
0.01µF
(Note 1)
0.1µF
(Note 1)
Ground
C
L
(Note 3)
Tri-State or
Power Down
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass
capacitor close (less than 2mm) to the package ground and supply voltage pin is required.
Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and
High bandwidth (>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet
for ‘Load Drive Capability’.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 4 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
EP13E7D2J-24.000M
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
T
S
MAX to T
L
(Ramp-up Rate)
Preheat
- Temperature Minimum (T
S
MIN)
- Temperature Typical (T
S
TYP)
- Temperature Maximum (T
S
MAX)
- Time (t
S
MIN)
Ramp-up Rate (T
L
to T
P
)
Time Maintained Above:
- Temperature (T
L
)
- Time (t
L
)
Peak Temperature (T
P
)
Target Peak Temperature (T
P
Target)
Time within 5°C of actual peak (t
p
)
Ramp-down Rate
Time 25°C to Peak Temperature (t)
Moisture Sensitivity Level
3°C/Second Maximum
150°C
175°C
200°C
60 - 180 Seconds
3°C/Second Maximum
217°C
60 - 150 Seconds
260°C Maximum for 10 Seconds Maximum
250°C +0/-5°C
20 - 40 Seconds
6°C/Second Maximum
8 Minutes Maximum
Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 5 of 6
Ecliptek, LLC
5458 Louie Lane, Reno, NV 89511
1-800-ECLIPTEK or 714.433.1200
